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Shenzhen Baiqiancheng Electronic Co.,Ltd.(BQC)
          
Address:No.343,Changfeng Road,Changzhen Community, Guangming New District,Shenzhen,Guangdong Province, China 518132
          
Tel:86-0755-26788241
          
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          Industry NewsNews > Industry News > PCB warpage    
          
		
          
		
          
			
          
				
          PCB warpage
          
				
          Hits:1  Add Date:2025/7/12
          
			
          
PCB warpage refers to the bending or twisting deformation of printed circuit boards during manufacturing or use, typically caused by material, process, or environmental factors. Minor warpage may not affect functionality, but severe deformation can lead to soldering defects, component detachment, or even circuit failure.


          1.Common Causes
          Material Issues: Mismatched coefficients of thermal expansion (CTE) in PCB substrates (e.g., FR-4) cause uneven shrinkage after cooling.

          Processing Temperature: High temperatures during reflow or wave soldering soften the board, leading to deformation due to stress release upon cooling.

          Asymmetric Structure: Uneven PCB lamination or unbalanced copper layer distribution (e.g., large single-sided copper foil) results in imbalanced stress.

          Storage Environment: Moisture absorption in humid environments causes expansion when heated (proper moisture-proof packaging is essential).

          2.Impacts and Solutions
          SMT Defects: Warpage causes component misalignment, requiring stencil thickness optimization or placement pressure adjustment.

          Test Failures: Severe warpage may lead to poor probe contact (ICT/FCT testing).

          Improvement Methods: Use high-Tg (glass transition temperature) materials, balance copper layer design, optimize reflow soldering temperature profiles, or employ fixtures (carriers) for stabilization.


          In high-end electronics (e.g., smartphones, automotive electronics), PCB warpage control is particularly stringent, typically requiring warpage < 0.75% (IPC standard). Material selection and process optimization can effectively mitigate warpage risks.

          
			
          
			
          
		
          
		
          
	
          
	
          

          

          

          
	
          
Address:No.343,Changfeng Road,Changzhen Community, Guangming New District,Shenzhen,Guangdong Province, China 518132    Tel:86-0755-26788241    Fax:86-0755-26788245
          
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